Description

PW-OU02 Universal Bond Tester

 

Product Description

Precision Bond Testing Solution for Advanced Materials
The PW-OU02 universal bond tester is engineered specifically for manufacturers and laboratory professionals requiring detailed bonding strength analysis of electronic components and materials. This instrument addresses the needs of process engineers, quality assurance teams, and R&D specialists by providing reliable and comprehensive testing capabilities. Equipped to perform push, pull, and pressure tests, this system supports complex assessments such as shear tester adhesion test and peel test, enabling users to obtain accurate data pertinent to product validation and compliance verification within high-tech manufacturing contexts.

Cutting-Edge Design with High-Resolution Measurement
Featuring plug-and-play sensor modules and automatic sensor recognition, the universal testing equipment allows for streamlined configuration and uninterrupted operation. It provides 24-bit high-speed data acquisition, capturing precise force measurements with sensor accuracy of 0.015% and force accuracy up to 0.10%. The vertical positioning system delivers micro-scale resolution down to 0.1 μm, while dual joysticks enable intuitive 4-axis control. The integrated Windows-based software supports real-time monitoring, SPC analysis, and data export, optimizing test repeatability and analytical transparency within the bond tester framework.

Application Versatility in Semiconductor and Microelectronics Industries
This bond tester is extensively applied in semiconductor packaging, LED assembly, chip microelectronics, camera module adhesion, and power module bonding inspections. It provides essential metrics for shear tester adhesion test validations and peel strength tester protocols, facilitating robust quality control and process optimization. Industry users benefit from its adaptability to a broad range of bond types and destructive/non-destructive peel test scenarios, assisting in compliance with stringent industrial standards and accelerating new product development cycles.

Scope of Application

The Universal Bond Tester is applied to: semiconductor packaging test, chip microelectronic test, LED packaging test, camera module test, IGBT power module test, optical communication device test, SMD component test, PCBA component test, etc.

 

Equipment Purpose & Operation Method

1. Push Test

   Move the test head above the product using the left/right joysticks. Press the test key; the Z-axis automatically moves down. When the test needle touches the test substrate, the Z-axis stops descending, then rises to the preset shear height and stops.

   The Y-axis moves according to software parameters. After completing the set distance, the machine stops.

   The software displays the force process as a curve, analyzes and records the peak force value.

2. Pull Test

   Move the pull test head to the target object using the joysticks. Press the test key; the Z-axis automatically moves upward.

   When the set force is reached, the machine stops and can automatically return to the original position (return function is optional).

   The software displays force distribution via force-time graph, histogram, and Pareto trend chart. It analyzes, displays and saves the maximum force or preset qualified force value.

3. Pressure Test

   Press the test key; the Z-axis moves downward for destructive or non-destructive testing.

   When the detected force reaches the preset value, the machine stops and retracts (or not). Force parameters are displayed and saved.

4. Additional Measurement

   The wire arc height and chip size can be measured simply as required, with a precision of 2 μm (actual precision depends on operation).

 

 

Features & Advantages

• Plug-and-play sensor modules: Multiple sensor modules can be configured. The software automatically identifies and switches to the current test module within 10 seconds without manual range switching.
• Self-developed high-frequency dynamic sensors: As one of the few domestic manufacturers with independent R&D and production capabilities, we have broken foreign monopolies. Our sensors are compatible with advanced imported push-pull testers and highly recognized in the industry.
• 24-bit high-speed data acquisition system: Ensures high-precision test data.
• High-precision, high-resolution vertical positioning for shear height.
• Software supports parameter settings for both destructive and non-destructive tests.
• Developed by a PhD expert with over 20 years of motion control experience: stable and safe operation.
• Axis motors are more durable and reliable than imported machines, with full compatibility.
• Unique safety limit and software speed control for optimized operation.
• Simple PC connection: only 2 RS232 cables, adopting the advanced communication standard for upgraded foreign equipment, replacing traditional complex wiring.
• User-friendly lighting adjustment, simpler and more intuitive than bulky foreign designs.
• Standard high-definition observation microscope; customizable with other brands upon request.
• Large dual joysticks for 4-direction control + user-friendly software: simple, convenient, one-key automatic test.
• Comprehensive protection to prevent equipment damage from misoperation.
• Fully customizable products according to customer requirements.

 

Equipment Parameters

Gold Ball Shear Test	Standard module: BS250G  ；Measuring range: 0–250 g ；Comprehensive test accuracy: ≤ 0.1% ；Sensor accuracy: 0.015%
Die & High Force Shear Test	Standard modules:  BS5KG (0–5 kg), DS50KG (0–50 kg), DS100KG (0–100 kg), DS200KG (0–200 kg)；Comprehensive test accuracy: ≤ 0.10%；Sensor accuracy: 0.015%
Pull Test	Test modules:  WP100G (0–100 g), WP2.5KG (0–2.5 kg), WP10KG (0–10 kg), WP30KG, WP100KG Comprehensive test accuracy: ≤ 0.25% (Various measuring ranges available upon customer request) Sensor accuracy: 0.015%
Compression Test	PP5KG (0–5 kg), PP10KG (0–10 kg), PP100KG (0–100 kg)；Non-standard customization supported；Accuracy: ≤ 0.1%
X.Y.Z Working Stroke	Effective stroke: XY： 100 mm, Z： 80 mm；Resolution: ±0.0003 mm
Control & Operation	Dual joysticks control 4-axis movement, simple and efficient.  Joystick operation resolution: 0.2 μm (world-leading level).
Operating System	PC-based, compatible with Windows 7 / Windows 10. User-friendly software; all test data and curves can be saved and exported in real time. Built-in SPC functions: max, min, mean, CPK calculation, test time, operator info, and customizable output. Open and compatible MES system, connectable to factory intranet for real-time data upload.
Power Supply	220V±5%
Dimensions	570 × 350 ×650 mm

 

 

Equipment Highlights

• Measuring stroke: 78 × 78 × 78 mm
• Accuracy: 1 μm
• Resolution: 1 μm

 

 

Technical Specifications

• Force Ranges & Accuracy
  • Ranges: 100 g, 200 g, 1 kg, 5 kg, 10 kg, 20 kg

    Test accuracy: 0.1%

  • Ranges: 250 g, 1 kg, 5 kg, 20 kg, 100 kg

    Test accuracy: 0.1%

• Software Functions

  The software supports:

  • Die shear test
  • Gold wire pull test
  • Gold ball shear test
• Axis Specifications
  • X-axis

    Effective stroke: ≥ 100 mm

    Max. speed: 2 mm/s

    Resolution: 0.1 μm

  • Y-axis

    Effective stroke: ≥ 100 mm

    Max. speed: 2 mm/s

    Resolution: 0.1 μm

  • Z-axis

    Effective stroke: ≥ 80 mm

    Max. speed: 2 mm/s

    Resolution: 0.1 μm

  • Max. running speed: 6 mm/s
  • Z-axis minimum test positioning height: < 1 μm
• Stage & Fixture
  • The stage is compatible with various fixtures.
  • Fixtures can rotate 360°.

• Observation System

  Equipped with a microscope for observing samples on the stage.
• System & Software

  Built-in PC with Windows OS.  The software is easy to operate and can display test data and force distribution curves in real time.

FAQ

Can the PW-OU02 test different types of bonds in semiconductor packaging?
Yes, our universal bond tester is designed for various bonding assessments including shear and pull strength in semiconductor packaging. It supports precision tests on gold ball bonds and chip microelectronics to ensure reliable adhesion and quality control.

Do you offer customization to adjust force ranges on the bond tester?
We provide multiple sensor modules ranging from 100 g to 100 kg and can customize force ranges to suit your specific requirements. This flexibility ensures the bond tester matches diverse testing needs in microelectronics and LED packaging.

What software capabilities come with the PW-OU02 for data analysis?
Our PC-based software includes real-time force curve display, SPC integration, and data export options compatible with factory MES systems. This enables detailed analysis for shear tester adhesion test workflows and improved production traceability.

How is the installation and maintenance of the PW-OU02 handled?
We offer technical support for installation to ensure your unit functions optimally. Routine maintenance involves checking sensor calibration and motion controls. Our experienced team is available to assist with operational queries for your peel strength tester application.